PCDVD數位科技討論區 - 瀏覽單個文章 - 台積電再勝三星！奪下Nvidia次世代GPU訂單

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作者wwchen

這一點也不意外! 畢竟是合作多年的朋友, 設計的製造難處比較清楚.

tsmc 這幾年是又快又穩.

還有, 樓上說 HBM 部分.
這是使用 TSV 3D 封裝技術, 未來的趨勢, 要如何鎖死!?

現在就等 tsmc 的 3D IC 封裝量產了. 這一局, 日月光
矽品等大封裝廠是大眼流口水, 吃不到, 也無能為力了.

引用英文維基High Bandwidth Memory條目
https://en.wikipedia.org/wiki/High_Bandwidth_Memory

The development of System in Package with High Bandwidth Memory began at AMD in 2008 to solve the problem of ever increasing power usage and form factor of computer memory. AMD and SK Hynix jointly developed it and started HBM's high volume manufacturing at TSV Packaging facility in Icheon, Korea from 2015. AMD commercialized 2.5D SiP with HBM in partners from the memory industry (SK Hynix), interposer industry (UMC) and packaging industry (Amkor Technology and ASE) to help AMD realize their vision of HBM.[5]

有聯電有日月光就是沒台積電...