引用:
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作者EANCK
『 HBM只需要5×7＝35毫米，而且是圍繞著GPU核心統一封裝』
我在想這個散熱器以後要怎麼設計啊?
DIE是很脆弱的東西，GPU 和 HBM 的 高度差只要有0.2mm，就能明顯觀察到壓力集中於某處，
壓潰了DIE就廢了。
高階GPU的發熱量不低，HBM 就算將到1.3V也有一定的發熱量，
如果使用目前常見用於記憶體的導熱貼塊，
均攤壓力的能力是不錯，但這種厚度要如何快速傳導熱能?
若將導熱膏塗超厚來當緩衝材用，無視散熱器傳熱底座會壓出多少導熱膏，
這樣會浪費多少導熱膏?
若果斷差0.2mm，那就表示GPU或 HBM 其一上面的導熱膏就至少0.2mm厚，
有點厚啊。
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http://techreport.com/review/28294/...ory-explained/3
Fortunately, Macri told us the power density situation was "another beautiful thing" about HBM. He explained that the DRAMs actually work as a heatsink for the GPU, effectively increasing the surface area for the heatsink to mate to the chips. That works out because, despite what you see in the "cartoon diagrams" (Macri's words), the Z height of the HBM stack and the GPU is almost exactly the same. As a result, the same heatsink and thermal interface material can be used for both the GPU and the memory.
初期HBM架構只要能穩跑就OK, 以後應該還會陸續改良, 讓整個結構更加穩重完整.