原文是德文，經由google翻譯後如以下

After the rather disappointing performance of the Gigabyte Windforce OC R9 290 in our tests we used the contact to Gigabyte and jointly sought in advance after the causes. The manufacturer shall react promptly and modify production.

rectification
To avoid possible misunderstandings , we have discussed with Gigabyte again our correspondence and the information that was sent to us from different sides in order to reach a final clarification :

The information published by us and the quote about the change in production , as well as the problems with the supplier concerned maximum single copies of the pre-series , but never made it so loud gigabyte on the market. There we stood with gigabytes in contact for some time , a temporal overlap has obviously taken care of a misunderstanding , we were able to correct this now .

Early press samples were delivered with a not yet optimized BIOS , too, the trade should not be affected or only to a small extent . Gigabyte has changed the BIOS to the change published by us , not the radiator. This was interpreted by some media in the copy as " cessation of production " , or mistranslated , because the reported by us temporary stop or change , as published as well in the title from the beginning, are something else entirely.
The pictured of us lack in size and thickness of the copper plate is indeed one of the reasons for a slightly higher temperature, but not the main reason for the poor performance of the press samples in the reviews . For this purpose makes the Gigabyte BIOS responsible .
Gigabyte will use the experience gained with the high heat density of Hawaii chips on the R9 290 (X), for optimizing the current cooler for future products on to the next generations of chips so with smaller feature size also be able to meet . A newer revision of the Windforce cooler on the R9 290 (X) is, however, not be excluded at a later date

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