Announcing S-PAL8952 Heat Sink for Pentium 4 (socket 478)

We would like to introduce a new Intel Pentium 4 heat sink, the S-PAL8952. This heat sink is for Socket 478 processors. Compared to our current P4 heat sink, we have increased the size and changed the fin pattern. Due to these changes, we have been able to improve the performance. The performance improvements make this heat sink the ideal choice for the new Prescott, Northwood and Extreme Edition processors from Intel, which run much hotter than the previous Northwood chips.

Some of the features of this heat sink:

The S-PAL8952 shares many design features with the current PAL8942. They both mount through the four holes surrounding Socket 478. We increased the fin length by 10 mm and changed the fin pattern. The new fin pattern design is based on the air flow within the heat sink. The shape of the outside pins is square and inside pins are round. The intake cover is longer to prevent any air from taking a short cut past the hottest portion of the pins. These changes have improved the airflow and thermal performance of the heat sink.

According to our test results, we have improved performance with both high speed and low speed fans.

S-PAL8952 +M81fan 0.22 deg C/W
Note: M81 = Delta AFB0812SH-F00 (80x80x25.4mm)
4000RPM / 40db(A)

S-PAL8952 +M82fan 0.295 degC/W
Note : M82 = Sanyo Denki 109P0812M701 (80x80x15mm)
2000RPM / 21db(A)

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Announcing S-PAL8045 and S-PAL8055 Heat Sinks for Athlon, Duron, Athlon XP/MP ( Socket A)

We would like to introduce our latest heat sinks, the S-PAL8045 and S-PAL8055, designed for AMD Socket A processors.

Some of the new features make these products ideal for the latest Socket A boards.

The S-PAL8045/55 does NOT require the 4 holes surrounding the socket for mounting. The heat sink mounts to a custom bracket (FLG462) attached directly to the socket. The new base shape accommodates the entire AMD keep-out area. With these two new design, the S-PAL8045/55 should be compatible with almost every socket A board available.

The new fin pattern design is based on the airflow within the heat sink. Visually, the outside pins are square, and inside pins are round. The intake cover of each S-PAL8045/55 is longer, preventing air from taking a short cut past the hottest portion of the pins. These changes have improved the airflow and thermal performance of the heat sinks.

Those customers who wish to attach the S-PAL8045/55 directly to the MB via standoffs will need to obtain the MTGH-SPL80S mounting hardware kits. This kit contains all of the hardware required to attach the heat sink directly to the MB if the 4 holes surrounding the socket are present. Of course this kit is not required, as the FLG426 mounting bracket should work with any socket A board, but is only offered as an optional mounting method.

We will be selling the FLG462 attachment bracket as an accessory. However, the following should be noted. Owners of the current PAL8045 heat sink should be aware that the FLG462 mounting bracket is not compatible with the base of the PAL8045 due to differences in the machining. If PAL8045 owners want to use the FLG462 mounting bracket, they would need to modify the base of their heat sinks at their own risk.

The PAL8045 series has been discontinued for sale. The S-PAL8045/55 have taken its place as our high-end Socket-A heat sinks.

S-PAL8045 +M81 fan 0.28 deg C/W
Note: M81 = Delta AFB0812SH-F00 (80x80x25.4mm)
4000RPM / 40db(A)
Heat sink Height: 45 mm

S-PAL8055 +M81 fan 0.27 degC/W
Note: M81 = Delta AFB0812SH-F00 (80x80x25.4mm)
4000RPM / 40db(A)
Heat sink Height: 55 mm

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新舊產品的效能比較: (後方的熱阻值越低越好)
熱阻值的粗略看法...

CPU運作溫度=散熱器熱阻xCPU發熱量+機殼內溫度
ex:
全速運轉耗電量100W的CPU使用S-PAL8952M81在25度的機殼溫度中,
CPU的全速運轉溫度=0.22*100+25=47度

S-PAL8952M81----80x25mm 47CFM Fan 0.22 deg C/W
S-PAL8952M82----80x15mm 20CFM Fan 0.295 deg C/W
S-PAL8055M81----80x25mm 47CFM Fan 0.27 deg C/W
S-PAL8045M81----80x25mm 47CFM Fan 0.28 deg C/W
PAL8942M81---- 80x25mm 47CFM Fan 0.23 deg C/W
PAL8942M82---- 80x15mm 20CFM Fan 0.31 deg C/W
PAL8045U 0.28 deg C/W

[以上文字引用自ALPHA官方網頁 www.micforg.co.jp]


結論:
由PAL8045U以及S-PAL8055M81的0.28,0.27熱阻值看來,
新產品在散熱性能上有所提升, 但無法達到"驚人"的提升效果,
這大家需要了解一下...

而且, 新的S-PAL8045/55的安裝基座無法使用在舊的PAL8045上,
原廠的說明好像是散熱器底面無法安裝, 可能有部分銅底會卡到吧...

報告完畢